July 31, 2024
Inner Circle
Thermoplastic Piping Systems In Silicon Carbide Wafer Fabs
Silicon carbide (SiC) has emerged as a pivotal material in the semiconductor industry due to its unique electrical properties compared to traditional silicon. SiC devices enable higher efficiency, lower losses, and enhanced performance, making them indispensable for modern power electronics and electric vehicle technologies.
One of the distinguishing features of SiC wafer processing is the significantly higher process temperatures required compared to silicon wafers. SiC wafer processing fabs may generate 1.5 times more heat compared to similarly-sized silicon wafer fabs. In addition to upsizing process cooling water lines, the thermal output necessitates robust thermal management strategies to maintain optimal operating conditions and equipment reliability.
The higher process temperatures associated with SiC wafer fabrication require specialized infrastructure within fabs. One of the critical considerations is the material used for piping systems to handle waste streams. Unlike silicon wafer fabs, where standard materials like polyvinyl chloride (PVC) may suffice for many waste lines, SiC fabs must utilize materials capable of withstanding higher temperatures and chemical exposure. Careful consideration should be given to adopting advanced thermoplastics such as polyvinylidene fluoride (PVDF) or ethylene chlorotrifluoroethylene (ECTFE). Both offer superior resistance to high temperatures and corrosive chemicals. These materials ensure the integrity and longevity of the piping infrastructure under the demanding conditions of these processes.
Moreover, the high process temperatures involved in SiC wafer processing necessitate a thoughtful approach to address the thermal expansion characteristics of thermoplastic materials. The significant expansion and contraction of thermoplastics under temperature variations highlight the importance of incorporating expansion loops into the piping design. Expansion loops serve as flexible elements within the piping system, accommodating thermal expansion without imposing undue stress on the pipes and connections. By integrating expansion loops strategically within the piping layout, semiconductor fab owners can mitigate the risks of pipe damage, leaks, and system failures caused by thermal expansion, ensuring the long-term performance and durability of the infrastructure.
SiC wafer processing represents a critical frontier in semiconductor technology. The unique challenges posed by higher process temperatures necessitate specialized infrastructure solutions, particularly in piping systems where materials like PVDF and ECTFE excel. Asahi/America’s engineering team is positioned to address these challenges and work with facilities and design engineers to optimize system performance, reliability, and longevity.
EDITOR’S NOTICE: Please note, the information in this article is for educational purposes only and does not supersede any Asahi/America technical information or product specifications. Please consult Asahi/America’s technical department at 1-800-343-3618 or [email protected] on all product applications in regards to material selection based on the pressure, temperature, environmental factors, chemical, media, application, and more.
